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high speed PCB and EMC design -(4)  

2007-05-07 00:50:55|  分类: 无线通信 |  标签: |举报 |字号 订阅

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Reducing Conducted and Radiated Emissions

1. Keep all metal structures at the same RF voltage.

2. Do not use gaps in the return plane, except to control the location of low frequency (kHz) currents.

3. Do not allow any traces to cross any gaps in the return plane.

4. Most low frequency (kHz) I/O lines need HF(MHz) decoupling to the signal return (Ground) at the connector to reduce VDM applied to the cable.

5. The circuit board signal return needs a HF (MHz) connection to any surrounding metal chassis at the connector to reduce VCM applied to the cable.

6. Use the longest rise time possible for all pulse signals.

7. Use logic families that are no faster than necessary.

7. Use the lowest clock frequency possible.

8. Keep all clock lines as short as possible.

9. Tightly control the loop area of all high speed signals.

10. Do not split or gap the return plane under any connector.

11. For filter capacitors to be effective near 100MHz, essentially zero lead length is required. An “X” style lead connection may be necessary for a shunt capacitor.

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